혜성 옵틱스 CI

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Haesung Vina

Haesung Vina

Company Information

Haesung Vina is producing mobile lens modules,
combining lens modules and AF actuators.

  • Establishment dateMarch 2011
  • Number of employees2000
  • CapitalU$ 13 million / U$ 5 million
  • ProductAF actuator, Camera module
  • LocationNo 43, Lot CN7, Khai Quang Industrial Zone Vinh Yen City
    Vinh Phuc Province, Vietnam

VCM process introduction

SUB process
A process of preparing the FPCB Assy and Housing Assy
Main assembly
A process of assembling the H/S Assy and Lens and performing property inspection(operation, resolution) and visual inspection.
IR-Attach
A process of attaching the IR Cut-off Filter to VCM

PKG process introduction

D/A process
Bonding process of Image Sensor + PCB,
bond using heat curing epoxy (Abbreviation for Die Attach)
DW/B process
After the D/A, connect the surface of the Image Sensor Pad with the lead part of the PCB with wire (Abbreviation for Wire Bonding) A phase for configuring the circuit for the Unit Sensor to have electrical characteristics
Wet process
After the W/B, a process of removing impurity from the surface of the Sensor, Mixed use of DI Water + Chemical (Abbreviation for Wet Cleaning)

FINISH process introduction

Soldering
A process of connecting the terminals to FPCB and VCM that direct affects the Auto focus function.
AF cal
A process of recording the AF value of the product that direct affects the quality of resolution.
Lsc Cal
Illumination source. Balance determining input record.
  1. Step 01
    VCM process
    Sub,Main,IR-Attach
    1. SUB공정 01SUB process
    2. Main조립 02Main assembly
    3. IR-Attach 03IR-Attach
  2. Step 02
    PKG process
    Precision matching process
    1. SUB공정 04D/A process
    2. Main조립 05W/B process
    3. IR-Attach 06WET process
  3. Step 03
    FINISH process
    Resolution & quality inspection of finished products
    1. SUB공정 07Soldering
    2. Main조립 08AF Cal
    3. IR-Attach 09LSC Cal